NXP 74HCT75N

表面安装

NO

终端数量

16

Ihs Manufacturer

飞利浦半导体

Load Capacitance (CL)

50 pF

Manufacturer

Philips Semiconductors

Manufacturer Part Number

74HCT75N

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Description

DIP, DIP16,.3

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Part Life Cycle Code

Transferred

Prop.

42 ns

Risk Rank

8.48

Rohs Code

有

Supply Voltage-Nom (Vsup)

5 V

子类别

FF/Latches

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

2

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

资历状况

不合格

电源

5 V

温度等级

AUTOMOTIVE

比特数

2

逻辑IC类型

D 拉锁

最大 I(ol)

0.004 A