NXP 74LV174DB-T

表面安装

YES

终端数量

16

Ihs Manufacturer

飞利浦半导体

Load Capacitance (CL)

50 pF

Manufacturer

Philips Semiconductors

Manufacturer Part Number

74LV174DB-T

Max

20000000 Hz

Moisture Sensitivity Levels

1

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SSOP

Package Description

SSOP, SSOP16,.3

Package Equivalence Code

SSOP16,.3

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, SHRINK PITCH

Part Life Cycle Code

Transferred

Prop.

31 ns

Risk Rank

5.74

Rohs Code

有

Supply Voltage-Nom (Vsup)

3.3 V

子类别

FF/Latches

包装方式

TAPE AND REEL

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

功能数量

6

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源

3.3 V

温度等级

AUTOMOTIVE

逻辑IC类型

D FLIP-FLOP

最大 I(ol)

0.006 A

触发器类型

积极优势