NXP 74LV175PW

表面安装

YES

终端数量

16

Package Description

TSSOP, TSSOP16,.25

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP16,.25

Operating Temperature-Min

-40 °C

Operating Temperature-Max

125 °C

Rohs Code

有

Manufacturer Part Number

74LV175PW

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Max

20000000 Hz

Risk Rank

5.73

Prop.

45 ns

子类别

FF/Latches

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

功能数量

4

端子间距

0.635 mm

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源

3.3 V

温度等级

AUTOMOTIVE

逻辑IC类型

D FLIP-FLOP

最大 I(ol)

0.008 A

触发器类型

积极优势

达到SVHC

unknown