NXP 82S123B/BEA

表面安装

NO

终端数量

16

RoHS

Non-Compliant

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Number of Words Code

32

Package Body Material

CERAMIC

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

82S123B/BEA

Number of Words

32 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.8

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

OTP ROM

技术

TTL

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

5 V

温度等级

MILITARY

组织结构

32X8

内存宽度

8

筛选水平

38535Q/M;38534H;883B

内存IC类型

OTP ROM