NXP 935263687557

表面安装

YES

终端数量

64

Clock Frequency-Max

24.578 MHz

Ihs Manufacturer

NXP SEMICONDUCTORS

Manufacturer

恩智浦半导体

Manufacturer Part Number

935263687557

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Description

LFBGA,

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Part Life Cycle Code

Obsolete

Part Package Code

BGA

Risk Rank

5.83

Supply Voltage-Max

3.6 V

Supply Voltage-Min

2.7 V

Supply Voltage-Nom

3.3 V

HTS代码

8542.31.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

引脚数量

64

JESD-30代码

S-PBGA-B64

资历状况

不合格

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

座位高度-最大

1.5 mm

边界扫描

NO

低功率模式

NO

串行I/O数

6

最大数据传输率

25 MBps

长度

8 mm

宽度

8 mm