NXP 9352 888 68518

表面安装

YES

终端数量

32

Usage Level

Automotive grade

Risk Rank

5.74

Part Life Cycle Code

生命周期结束

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Package Shape

RECTANGULAR

Package Description

HTSSOP,

Package Code

HTSSOP

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

125 °C

Manufacturer Part Number

935288868518

Manufacturer

恩智浦半导体

Ihs Manufacturer

NXP SEMICONDUCTORS

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

功能数量

1

端子间距

0.65 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G32

温度等级

AUTOMOTIVE

座位高度-最大

1.1 mm

筛选水平

AEC-Q100

通信IC类型

电路接口

宽度

6.1 mm

长度

11 mm