NXP 935293495118

表面安装

YES

终端数量

14

RoHS

Non-Compliant

Package Description

TSSOP,

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Operating Temperature-Max

125 °C

Manufacturer Part Number

935293495118

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

恩智浦半导体

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.73

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

功能数量

4

端子间距

0.65 mm

Reach合规守则

compliant

JESD-30代码

R-PDSO-G14

温度等级

AUTOMOTIVE

座位高度-最大

1.1 mm

通信IC类型

电路接口

宽度

4.4 mm

长度

5 mm