NXP BDY23

终端数量

2

晶体管元件材料

SILICON

Package

Bulk

Base Product Number

U001

厂商

M5Stack Technology Co., Ltd.

Product Status

Obsolete

Package Description

FLANGE MOUNT, O-MBFM-P2

Package Style

FLANGE MOUNT

Package Body Material

METAL

Operating Temperature-Max

200 °C

Transition Frequency-Nom (fT)

10 MHz

Manufacturer Part Number

BDY23

Package Shape

ROUND

Manufacturer

New Jersey Semiconductor Products Inc

Number of Elements

1

Part Life Cycle Code

活跃

Ihs Manufacturer

NEW JERSEY SEMICONDUCTOR PRODUCTS INC

Risk Rank

5.64

系列

-

类型

Sensor

端子位置

BOTTOM

终端形式

PIN/PEG

Reach合规守则

unknown

JESD-30代码

O-MBFM-P2

功能

Humidity, Pressure, Temperature

配置

SINGLE

使用的 IC/零件

BMP280, SHT30

极性/通道类型

NPN

内容

Board(s)

集电极电流-最大值(IC)

6 A

平台

M5Stack

集电极-发射器电压-最大值

60 V