NXP BGY133

包装/外壳

0805 (2012 Metric)

供应商器件包装

0805

Package

Tape & Reel (TR)

Base Product Number

RS73G2A

厂商

KOA Speer Electronics, Inc.

Product Status

活跃

Package Body Material

CERAMIC

Package Equivalence Code

MOT CASE 700-04

Operating Temperature-Min

-20 °C

Operating Temperature-Max

90 °C

Manufacturer Part Number

BGY133

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.71

操作温度

-55°C ~ 155°C

系列

RS73

尺寸/尺寸

0.079 L x 0.049 W (2.00mm x 1.25mm)

容差

±0.5%

终止次数

2

温度系数

±50ppm/°C

电阻

487 kOhms

组成

厚膜

功率(瓦特)

0.25W, 1/4W

子类别

RF/Microwave Amplifiers

技术

HYBRID

Reach合规守则

unknown

电源

12.5 V

特征

Automotive AEC-Q200, Moisture Resistant

座位高度(最大)

0.024 (0.60mm)

评级结果

AEC-Q200