NXP BGY200

表面安装

YES

越来越多的功能

SURFACE MOUNT

终端数量

5

Package

零售包装

厂商

Glenair

Product Status

活跃

Package Body Material

CERAMIC

Package Equivalence Code

SMSIP5/7H,.52,200

Operating Temperature-Min

-30 °C

Operating Temperature-Max

100 °C

Rohs Code

无

Manufacturer Part Number

BGY200

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.79

系列

*

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

RF/Microwave Amplifiers

技术

HYBRID

Reach合规守则

unknown

电源

7.2 V