NXP BGY41B

表面安装

NO

越来越多的功能

通孔安装

终端数量

19

Package Description

SIP19,.1TB

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SIP19,.1TB

Operating Temperature-Max

90 °C

Rohs Code

无

Manufacturer Part Number

BGY41B

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Obsolete

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

RF/Microwave Amplifiers

技术

HYBRID

Reach合规守则

unknown

电源

12.5 V