NXP BUK444-800A127

表面安装

NO

终端数量

3

晶体管元件材料

SILICON

Drain Current-Max (ID)

1.4 A

Ihs Manufacturer

NXP SEMICONDUCTORS

Manufacturer

恩智浦半导体

Manufacturer Part Number

BUK444-800A127

Number of Elements

1

Operating Temperature-Max

150 °C

Package Body Material

PLASTIC/EPOXY

Package Description

FLANGE MOUNT, R-PSFM-T3

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Part Life Cycle Code

Obsolete

Part Package Code

SFM

Risk Rank

5.84

端子位置

SINGLE

终端形式

THROUGH-HOLE

Reach合规守则

unknown

引脚数量

3

JESD-30代码

R-PSFM-T3

资历状况

不合格

配置

SINGLE WITH BUILT-IN DIODE

操作模式

增强型MOSFET

箱体转运

ISOLATED

晶体管应用

SWITCHING

极性/通道类型

N-CHANNEL

JEDEC-95代码

TO-220AB

漏极-源极导通最大电阻

6 Ω

脉冲漏极电流-最大值(IDM)

5.6 A

DS 击穿电压-最小值

800 V

场效应管技术

METAL-OXIDE SEMICONDUCTOR