NXP CBTU0808EE/G

表面安装

YES

终端数量

48

Ihs Manufacturer

NXP SEMICONDUCTORS

Manufacturer

恩智浦半导体

Manufacturer Package Code

SOT-918-1

Manufacturer Part Number

CBTU0808EE/G

Moisture Sensitivity Levels

2

Operating Temperature-Max

85 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Description

TFBGA,

Package Shape

SQUARE

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Part Life Cycle Code

Obsolete

Part Package Code

BGA

Reflow Temperature-Max (s)

30

Risk Rank

5.81

Rohs Code

有

Supply Voltage-Max

1.9 V

Supply Voltage-Min

1.7 V

Supply Voltage-Nom

1.8 V

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

0.5 mm

Reach合规守则

compliant

引脚数量

48

JESD-30代码

S-PBGA-B48

资历状况

不合格

温度等级

OTHER

uPs/uCs/外围ICs类型

BUS CONTROLLER, PCI

座位高度-最大

1.15 mm

长度

5 mm

宽度

5 mm