NXP GTL2003BQ

表面安装

YES

终端数量

20

Min. permitted bending radius, moving application/free movement

92

Min. permitted bending radius, stationary application/permanent installation

55

Nominal voltage U

500

Material outer sheath

Polyurethane (PUR)

Conductor category

Class 5 = flexible

Low smoke (according to EN 61034-2)

无

Nominal voltage U0

300

Screen over stranding

Braiding

Nominal cross section conductor

0.5

Core identification

Colour + rings

Screen over stranding element

None

Outer diameter approx.

7.3

Colour outer sheath

Purple

Material core insulation

Other

Permitted cable outer temperature after assembling without vibration

-40 - 90

Stranding element

无

Package Description

HVSON,

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

30

Supply Voltage-Min

3 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

GTL2003BQ

Package Code

HVSON

Package Shape

RECTANGULAR

Manufacturer

恩智浦半导体

Part Life Cycle Code

不推荐

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

3.6 V

Risk Rank

5.12

Part Package Code

QFN

JESD-609代码

e4

无铅代码

有

端子表面处理

Nickel/Palladium/Gold (Ni/Pd/Au)

端子位置

DUAL

终端形式

无铅

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

引脚数量

20

JESD-30代码

R-PDSO-N20

资历状况

不合格

温度等级

INDUSTRIAL

座位高度-最大

1 mm

接口IC类型

电路接口

电源电压1-额定值

2.5 V

源Url状态检查日期

2013-06-14 00:00:00

电源电压1-最小值

2.36 V

电源电压1-最大值

2.64 V

宽度

2.5 mm

长度

3 mm