NXP HEF4532BD

表面安装

NO

终端数量

16

Risk Rank

5.77

Ihs Manufacturer

飞利浦半导体

Part Life Cycle Code

Transferred

Manufacturer

Philips Semiconductors

Package Shape

RECTANGULAR

Package Code

DIP

Manufacturer Part Number

HEF4532BD

Rohs Code

无

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Equivalence Code

DIP16,.3

Package Body Material

CERAMIC

Package Style

IN-LINE

Package Description

DIP, DIP16,.3

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

算术电路

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

5/15 V

温度等级

INDUSTRIAL

逻辑IC类型

ENCODER