NXP HT1ICS3002W/V6F

表面安装

YES

Package Description

WAFER

Package Style

UNCASED CHIP

Package Body Material

UNSPECIFIED

Operating Temperature-Min

-25 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

HT1ICS3002W/V6F

Part Package Code

WAFER

Risk Rank

5.71

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Life Cycle Code

活跃

Manufacturer

恩智浦半导体

Package Shape

RECTANGULAR

Package Code

DIE

HTS代码

8542.39.00.01

端子位置

UPPER

终端形式

无铅

功能数量

1

Reach合规守则

unknown

JESD-30代码

R-XUUC-N

温度等级

OTHER

通信IC类型

电信电路