NXP HT1MOA2S30/E/3

表面安装

YES

终端数量

2

Package Description

DIE,

Package Style

UNCASED CHIP

Package Body Material

PLASTIC/EPOXY

Manufacturer Package Code

SOT500-2

Operating Temperature-Min

-25 °C

Supply Voltage-Nom

3.5 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

HT1MOA2S30/E/3

Package Code

DIE

Package Shape

RECTANGULAR

Manufacturer

恩智浦半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.84

Part Package Code

SOT

HTS代码

8542.39.00.01

端子位置

UPPER

终端形式

无铅

功能数量

1

Reach合规守则

unknown

引脚数量

2

JESD-30代码

R-PUUC-N

温度等级

OTHER

通信IC类型

电信电路