NXP HT2DC20S20/F

Package Description

, MODULE(UNSPEC)

Package Style

微电子组件

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

MODULE(UNSPEC)

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

HT2DC20S20/F

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.69

子类别

其他电信集成电路

技术

HYBRID

Reach合规守则

unknown

资历状况

不合格

温度等级

INDUSTRIAL

通信IC类型

电信电路