NXP ICM7555CN

表面安装

NO

终端数量

8

Package Description

DIP, DIP8,.3

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP8,.3

Operating Temperature-Max

70 °C

Rohs Code

有

Manufacturer Part Number

ICM7555CN

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.71

JESD-609代码

e4

端子表面处理

Nickel/Palladium/Gold (Ni/Pd/Au)

子类别

模拟波形生成功能

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T8

资历状况

不合格

电源

5/15 V

温度等级

COMMERCIAL