NXP IP3088CX15

表面安装

YES

终端数量

15

Package Description

WLCSP-15

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

IP3088CX15

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

Nexperia

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NEXPERIA

Risk Rank

5.63

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

功能数量

1

Reach合规守则

compliant

JESD-30代码

R-PBGA-B15

温度等级

INDUSTRIAL

座位高度-最大

0.7 mm

消费者集成电路类型

消费电路

宽度

1.28 mm

长度

2.96 mm