NXP IP4776CZ38-

表面安装

YES

终端数量

38

Package Description

TSSOP,

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

5 V

Reflow Temperature-Max (s)

30

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

IP4776CZ38

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Nexperia

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NEXPERIA

Risk Rank

5.47

附加功能

ALSO REQUIRES 3.3V BIAS SUPPLY NOMINAL FOR LEVEL SHIFTERS

HTS代码

8542.39.00.01

技术

NMOS

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

R-PDSO-G38

温度等级

INDUSTRIAL

座位高度-最大

1.1 mm

接口IC类型

电路接口

宽度

4.4 mm

长度

9.7 mm