NXP IP4855CX25

表面安装

YES

终端数量

25

Package Description

VFBGA,

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

2.9 V

Supply Voltage-Min

2.5 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

IP4855CX25

Package Code

VFBGA

Package Shape

SQUARE

Manufacturer

恩智浦半导体

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

5.5 V

Risk Rank

5.6

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.4 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B25

温度等级

INDUSTRIAL

座位高度-最大

0.5 mm

接口IC类型

电路接口

宽度

2.05 mm

长度

2.05 mm