NXP ISP1568AET

表面安装

YES

终端数量

100

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA100,10X10,32

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

ISP1568AET

Package Code

FBGA

Package Shape

SQUARE

Manufacturer

STMicroelectronics

Part Life Cycle Code

Obsolete

Ihs Manufacturer

STMICROELECTRONICS

Risk Rank

5.84

子类别

总线控制器

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B100

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL