NXP ISP1760ET，518

表面安装

YES

终端数量

128

Package Description

TFBGA, BGA128,16X16,20

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA128,16X16,20

Manufacturer Package Code

SOT-857-1

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

3 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

ISP1760ET,518

Clock Frequency-Max

12 MHz

Package Code

TFBGA

Package Shape

SQUARE

Manufacturer

恩智浦半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

3.6 V

Risk Rank

5.33

Part Package Code

BGA

子类别

总线控制器

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

引脚数量

128

JESD-30代码

S-PBGA-B128

资历状况

不合格

电源

1.8/3.3,3.3/5 V

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, UNIVERSAL SERIAL BUS

座位高度-最大

1.1 mm

地址总线宽度

17

外部数据总线宽度

32

宽度

9 mm

长度

9 mm