NXP MF1ICS7001W/V9D

触点镀层

Tin

房屋材料

Liquid Crystal Polymer (LCP)

Maximum Operating Temperature

+ 105 C

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

1500

Mounting Styles

PCB 安装

Contact Materials

Brass

Manufacturer

TE Connectivity

Brand

TE Connectivity

Package Description

, WAFER

Package Equivalence Code

WAFER

Operating Temperature-Min

-25 °C

Operating Temperature-Max

70 °C

Manufacturer Part Number

MF1ICS7001W/V9D

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.84

定位的数量

12 Position

应用

Power, Signal

行数

1 Row

子类别

Headers & Wire Housings

螺距

1.25 mm

Reach合规守则

unknown

终端样式

焊针

资历状况

不合格

触点性别

Pin (Male)

房屋颜色

Black

温度等级

OTHER

uPs/uCs/外围ICs类型

微处理器电路

产品类别

Headers & Wire Housings

产品

Headers

安装角

直角

产品类别

Headers & Wire Housings

可燃性等级

UL 94 V-0