NXP MFRC52201HN1/TRAYB

表面安装

YES

终端数量

32

Package Description

5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT617-1, HVQFN-32

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-25 °C

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

2.5 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

MFRC52201HN1/TRAYB

Package Code

HVQCCN

Package Shape

SQUARE

Manufacturer

恩智浦半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

3.6 V

Risk Rank

5.31

Part Package Code

QFN

端子位置

QUAD

终端形式

无铅

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

引脚数量

32

JESD-30代码

S-PQCC-N32

资历状况

不合格

温度等级

OTHER

座位高度-最大

1 mm

接口IC类型

电路接口

宽度

5 mm

长度

5 mm