NXP NT3H1101W0FTT

表面安装

YES

终端数量

8

Supply Voltage-Nom

1.8 V

Supply Voltage-Min

1.7 V

Supply Voltage-Max

3.6 V

Risk Rank

5.62

Part Life Cycle Code

活跃

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Shape

SQUARE

Package Description

3 MM, PLASTIC, SOT505-1, TSSOP-8

Package Code

TSSOP

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

95 °C

Manufacturer Part Number

NT3H1101W0FTT

Manufacturer

恩智浦半导体

Ihs Manufacturer

NXP SEMICONDUCTORS

HTS代码

8542.31.00.01

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.65 mm

Reach合规守则

unknown

JESD-30代码

S-PDSO-G8

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

微处理器电路

座位高度-最大

1.1 mm

宽度

3 mm

长度

3 mm