NXP NVT4556BUK

表面安装

YES

终端数量

12

Package Description

WLCSP-12

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.8 V

Supply Voltage-Min

1.55 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

NVT4556BUK

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

恩智浦半导体

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

3.6 V

Risk Rank

5.64

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.4 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B12

温度等级

INDUSTRIAL

座位高度-最大

0.412 mm

接口IC类型

电路接口

宽度

1.205 mm

长度

1.605 mm