NXP Semiconductors 74LVC07APW,118

安装类型

表面贴装

包装/外壳

14-TSSOP (0.173, 4.40mm Width)

供应商器件包装

14-TSSOP

ECCN (US)

EAR99

HTS

8542.39.00.01

Logic Family

LVC

Number of Elements per Chip

6

Number of Channels per Chip

6

Number of Inputs per Chip

6

Number of Input Enables per Chip

0

Number of Outputs per Chip

6

Number of Output Enables per Chip

0

Bus Hold

无

Maximum Propagation Delay Time @ Maximum CL (ns)

2.5(Typ)@3.3V|1.6(Typ)@5V|2.1(Typ)@2.7V

Absolute Propagation Delay Time (ns)

6.5

Process Technology

CMOS

Input Signal Type

Single-Ended

Maximum Low Level Output Current (mA)

32

Minimum Operating Supply Voltage (V)

1.2

Typical Operating Supply Voltage (V)

5|1.8|2.5|3.3

Maximum Operating Supply Voltage (V)

5.5

Tolerant I/Os (V)

5

Typical Quiescent Current (uA)

0.1

Maximum Quiescent Current (uA)

10

Propagation Delay Test Condition (pF)

50

Maximum Power Dissipation (mW)

500

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Supplier Package

TSSOP

Mounting

表面贴装

Package Height

0.95(Max)

Package Length

5.1(Max)

Package Width

4.5(Max)

PCB changed

14

Package

Bulk

Base Product Number

74LVC0

厂商

NXP USA Inc.

Product Status

活跃

Number of Elements

6

包装

卷带

系列

*

操作温度

-40°C ~ 125°C (TA)

零件状态

活跃

电压 - 供电

1.2V ~ 5.5V

引脚数量

14

输出类型

开漏极态

极性

Non-Inverting

输入类型

-

逻辑功能

Buffer/Driver

高/低输出电流

-, 32mA

逻辑类型

Buffer, Non-Inverting

每个元素的比特数

1

RoHS状态

符合RoHS标准