NXP Semiconductors FB2012AA

表面安装

YES

终端数量

68

Package Description

QCCJ, LDCC68,1.0SQ

Package Style

CHIP CARRIER

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

LDCC68,1.0SQ

Supply Voltage-Nom

5 V

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

FB2012AA

Package Code

QCCJ

Package Shape

SQUARE

Manufacturer

Philips Semiconductors

Risk Rank

5.72

Ihs Manufacturer

飞利浦半导体

Part Life Cycle Code

Transferred

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

系统接口逻辑

技术

BICMOS

端子位置

QUAD

终端形式

J BEND

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-PQCC-J68

资历状况

不合格

电源

5 V

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

SYSTEM INTERFACE LOGIC, BUS ARBITER AND CONTINUOUS SIGNAL GENERATOR

电源电流-最大值

120 mA