NXP Semiconductors HEF4752VP

表面安装

NO

终端数量

28

Package Description

DIP, DIP28,.6

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP28,.6

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

HEF4752VP

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.77

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Motion Control Electronics

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T28

资历状况

不合格

电源

5/10 V

温度等级

INDUSTRIAL

供应电流-最大值(Isup)

0.75 mA