NXP Semiconductors LPC1111FHN33/101

表面安装

YES

终端数量

33

ECCN (US)

3A991.a.2

Family Name

LPC1100

Instruction Set Architecture

RISC

Maximum CPU Frequency (MHz)

50

Maximum Clock Rate (MHz)

50

Data Bus Width (bit)

32

Programmability

有

Interface Type

I2C/SPI/UART

Number of I/Os

28

No. of Timers

4

Number of ADCs

Single

ADC Resolution (bit)

10

USART

0

UART

1

I2C

1

I2S

0

Watchdog

1

Minimum Operating Supply Voltage (V)

1.8

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Maximum Power Dissipation (mW)

1500

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

CECC Qualified

无

Standard Package Name

QFN

Supplier Package

HVQFN EP

Mounting

表面贴装

Package Height

0.83

Package Length

7

Package Width

7

PCB changed

32

Lead Shape

No Lead

Package Description

HVQCCN,

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

未说明

Supply Voltage-Min

1.8 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

LPC1111FHN33/101

Clock Frequency-Max

25 MHz

Package Code

HVQCCN

Package Shape

SQUARE

Manufacturer

恩智浦半导体

Part Life Cycle Code

活跃

Number of I/O Lines

28

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

3.6 V

Risk Rank

5.69

Part Package Code

QFN

JESD-609代码

e4

无铅代码

有

零件状态

活跃

端子表面处理

Nickel/Palladium/Gold (Ni/Pd/Au)

HTS代码

8542.31.00.01

技术

CMOS

端子位置

QUAD

终端形式

无铅

峰值回流焊温度（摄氏度）

未说明

端子间距

0.65 mm

Reach合规守则

compliant

引脚数量

32

JESD-30代码

S-PQCC-N33

资历状况

不合格

温度等级

INDUSTRIAL

速度

50 MHz

内存大小

2KB

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

程序存储器类型

Flash

程序内存大小

8KB

位元大小

32

有ADC

YES

DMA 通道

NO

脉宽调制通道

NO

数模转换器通道

NO

座位高度-最大

1 mm

核心架构

ARM

以太网

0

USB

0

只读存储器可编程性

FLASH

SPI,SPI

1

CAN

0

脉宽调制

1

ADC Channels

8

设备核心

ARM Cortex M0

宽度

7 mm

长度

7 mm

RoHS状态

符合RoHS标准