NXP Semiconductors LPC11E67JBD64

Contact plating

gold-plated

表面安装

YES

Number of pins

12

终端数量

64

捆绑中心至安装中心

131072

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x6

Row pitch

2.54mm

Gross weight

0.65 g

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

LQFP-64

Clock Frequency-Max

25 MHz

Number of I/O Lines

50

Operating Temperature-Max

105 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFQFP

Package Shape

SQUARE

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Supply Voltage-Max

3.6 V

Supply Voltage-Min

3.3 V

Supply Voltage-Nom

3.3 V

Operating temperature

-40...163°C

ECCN 代码

3A991.A.2

HTS代码

8542.31.00.01

端子位置

QUAD

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

unknown

Current rating

1.5A

JESD-30代码

S-PQFP-G64

温度等级

INDUSTRIAL

速度

50 MHz

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

位元大小

32

有ADC

YES

DMA 通道

YES

脉宽调制通道

YES

数模转换器通道

NO

座位高度-最大

1.6 mm

线圈型

20480

片上程序 ROM 宽度

8

Rated voltage

60V

只读存储器可编程性

FLASH

个人资料

beryllium copper

长度

10 mm

宽度

10 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0