NXP Semiconductors LPC11E68JBD100

表面安装

YES

终端数量

100

ECCN (US)

EAR99

HTS

8542.31.00.01

Family Name

LPC11E6x

Instruction Set Architecture

RISC

Maximum CPU Frequency (MHz)

50

Maximum Clock Rate (MHz)

50

Data Bus Width (bit)

32

Programmability

有

Interface Type

I2C/SPI/USART

Number of I/Os

80

No. of Timers

6

Number of ADCs

Single

ADC Resolution (bit)

12

USART

5

UART

0

I2C

2

I2S

0

Watchdog

1

Parallel Master Port

无

Real Time Clock

有

Minimum Operating Supply Voltage (V)

2.4

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Maximum Power Dissipation (mW)

1500

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

105

CECC Qualified

无

Standard Package Name

QFP

Supplier Package

LQFP

Mounting

表面贴装

Package Height

1.45(Max)

Package Length

14.1(Max)

Package Width

14.1(Max)

PCB changed

100

Lead Shape

Gull-wing

Package Description

LFQFP,

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

2.4 V

Operating Temperature-Max

105 °C

Manufacturer Part Number

LPC11E68JBD100

RAM(byte)

36864

Clock Frequency-Max

25 MHz

Package Code

LFQFP

Package Shape

SQUARE

Manufacturer

恩智浦半导体

ROM(word)

262144

Part Life Cycle Code

活跃

Number of I/O Lines

80

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

3.6 V

Risk Rank

5.76

包装

Tray

零件状态

活跃

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

unknown

引脚数量

100

JESD-30代码

S-PQFP-G100

温度等级

INDUSTRIAL

速度

50 MHz

内存大小

36KB

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

程序存储器类型

Flash

程序内存大小

256KB

位元大小

32

有ADC

YES

DMA 通道

YES

脉宽调制通道

YES

数模转换器通道

NO

座位高度-最大

1.6 mm

核心架构

ARM

片上程序 ROM 宽度

8

以太网

0

USB

0

只读存储器可编程性

FLASH

SPI,SPI

2

CAN

0

脉宽调制

1

ADC Channels

12

设备核心

ARM Cortex M0+

宽度

14 mm

长度

14 mm

RoHS状态

符合RoHS标准