NXP Semiconductors LPC1810FBD144

表面安装

YES

引脚数

144

终端数量

144

ECCN (US)

EAR99

Family Name

LPC1800

Instruction Set Architecture

RISC

Maximum CPU Frequency (MHz)

150

Maximum Clock Rate (MHz)

150

Data Bus Width (bit)

32

Programmability

无

Interface Type

CAN/I2C/I2S/SPI/UART/USART

Number of I/Os

83

No. of Timers

6

Number of ADCs

Dual

ADC Resolution (bit)

10/10

Number of DAC's

Single

DAC Resolution (bit)

10

Lead Shape

Gull-wing

PCB changed

144

Package Width

20.1(Max)

Package Length

20.1(Max)

Package Height

1.45(Max)

Mounting

表面贴装

Supplier Package

LQFP

Standard Package Name

QFP

CECC Qualified

无

Maximum Operating Temperature (°C)

85

Minimum Operating Temperature (°C)

-40

Maximum Power Dissipation (mW)

1500

Maximum Operating Supply Voltage (V)

3.6

Typical Operating Supply Voltage (V)

2.5|3.3

Minimum Operating Supply Voltage (V)

2.2

Special Features

CAN控制器

Watchdog

1

I2S

2

I2C

2

UART

1

USART

3

Package Description

20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT486-1, LQFP-144

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

2.2 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

LPC1810FBD144

Clock Frequency-Max

25 MHz

Package Code

LFQFP

Package Shape

SQUARE

Manufacturer

恩智浦半导体

Part Life Cycle Code

活跃

Number of I/O Lines

83

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

3.6 V

Risk Rank

5.73

Part Package Code

QFP

JESD-609代码

e3

零件状态

活跃

端子表面处理

TIN

HTS代码

8542.31.00.01

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.5 mm

Reach合规守则

compliant

时间@峰值回流温度-最大值(s)

30

JESD-30代码

S-PQFP-G144

温度等级

INDUSTRIAL

速度

180 MHz

内存大小

136KB

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

程序存储器类型

ROMLess

位元大小

32

有ADC

YES

DMA 通道

YES

脉宽调制通道

YES

数模转换器通道

1

座位高度-最大

1.6 mm

地址总线宽度

24

核心架构

ARM

外部数据总线宽度

32

以太网

0

USB

0

只读存储器可编程性

FLASH

SPI,SPI

4

CAN

2

脉宽调制

1

ADC Channels

8/8

设备核心

ARM Cortex M3

宽度

20 mm

长度

20 mm

RoHS状态

符合RoHS标准