NXP Semiconductors LPC55S66JBD64E

ECCN (US)

5A992.c

HTS

8542.31.00.01

Instruction Set Architecture

RISC

Maximum CPU Frequency (MHz)

150

Maximum Clock Rate (MHz)

150

Data Bus Width (bit)

32

Programmability

有

Interface Type

I2C/I2S/SPI/USART/USB

Number of I/Os

36

No. of Timers

5

Number of ADCs

Single

ADC Resolution (bit)

16

USART

8

UART

0

I2C

8

I2S

8

Minimum Operating Supply Voltage (V)

1.8

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

105

Supplier Package

HTQFP EP

Mounting

表面贴装

Package Height

1.05(Max)

Package Length

10

Package Width

10

PCB changed

64

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

160

Part # Aliases

935387731551

Manufacturer

NXP

Brand

恩智浦半导体

RoHS

Details

包装

Tray

零件状态

活跃

子类别

Microcontrollers - MCU

引脚数量

64

内存大小

144KB

程序存储器类型

Flash

程序内存大小

256KB

产品类别

ARM Microcontrollers - MCU

核心架构

ARM

以太网

0

USB

2

SPI,SPI

8

CAN

0

产品类别

ARM Microcontrollers - MCU

ADC Channels

10

设备核心

ARM Cortex M33

RoHS状态

符合RoHS标准