NXP Semiconductors MC9S08SG8MTG

表面安装

YES

Contact plating

gold-plated

Number of pins

24

终端数量

16

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

ROHS COMPLIANT, TSSOP-16

Clock Frequency-Max

16 MHz

Number of I/O Lines

12

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Supply Voltage-Max

5.5 V

Supply Voltage-Min

2.7 V

Supply Voltage-Nom

5 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x24

Gross weight

0.91 g

Operating temperature

-40...163°C

JESD-609代码

e3

端子表面处理

TIN

HTS代码

8542.31.00.01

端子位置

DUAL

终端形式

鸥翼

端子间距

0.65 mm

Reach合规守则

compliant

Current rating

1.5A

JESD-30代码

R-PDSO-G16

资历状况

不合格

温度等级

AUTOMOTIVE

速度

40 MHz

uPs/uCs/外围ICs类型

MICROCONTROLLER

位元大小

8

有ADC

YES

DMA 通道

NO

脉宽调制通道

YES

数模转换器通道

NO

座位高度-最大

1.2 mm

Rated voltage

60V

只读存储器可编程性

FLASH

个人资料

beryllium copper

长度

5 mm

宽度

4.4 mm

Plating thickness

0.254µm

Flammability rating

UL94V-0