NXP Semiconductors MK60DN512ZVMD10R

Contact plating

gold-plated

表面安装

YES

Number of pins

43

终端数量

144

捆绑中心至安装中心

524288

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x43

Gross weight

2.49 g

Rohs Code

有

Part Life Cycle Code

不推荐

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

LFBGA, BGA144,12X12,40

Clock Frequency-Max

32 MHz

Number of I/O Lines

104

Operating Temperature-Max

105 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA144,12X12,40

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Max

3.6 V

Supply Voltage-Min

3.3 V

Supply Voltage-Nom

3.3 V

Operating temperature

-40...163°C

ECCN 代码

3A991.A.2

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

Current rating

1.5A

JESD-30代码

S-PBGA-B144

资历状况

不合格

温度等级

INDUSTRIAL

速度

100 MHz

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

电源电流-最大值

87 mA

位元大小

32

有ADC

YES

DMA 通道

YES

脉宽调制通道

YES

数模转换器通道

YES

座位高度-最大

1.7 mm

线圈型

131072

片上程序 ROM 宽度

8

处理器系列

CORTEX-M4

Rated voltage

60V

只读存储器可编程性

FLASH

个人资料

beryllium copper

长度

13 mm

宽度

13 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0