NXP Semiconductors NE602N

表面安装

NO

越来越多的功能

通孔安装

终端数量

8

Package Description

DIP8,.3

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP8,.3

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

NE602N

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.76

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

RF/Microwave Mixers

技术

BIPOLAR

Reach合规守则

unknown

电源

6 V

电源电流-最大值

2.8 mA