NXP Semiconductors P89LPC952FBD

表面安装

YES

终端数量

44

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

QFP

Package Description

10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT389-1, LQFP-44

Clock Frequency-Max

18 MHz

Number of I/O Lines

40

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LQFP

Package Shape

SQUARE

Package Style

FLATPACK, LOW PROFILE

Supply Voltage-Max

3.6 V

Supply Voltage-Min

3 V

Supply Voltage-Nom

3.3 V

Gross weight

47.75

Transport package size/quantity

87*61*33/400

Diameter before shrink

D - 57 / d - 5x15 mm

Diameter after shrink

D1 - 29/ d1 - 5x7 mm

Number of fingers

5

Finger length

L1 = 55 +/- 5 mm

JESD-609代码

e2

无铅代码

有

类型

Heat shrink glove from TPI series with adhesive layer

端子表面处理

Tin/Silver (Sn/Ag)

颜色

Black

附加功能

ALSO OPERATES AT 2.4V SUPPLY

HTS代码

8542.31.00.01

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.8 mm

深度

(L) - 170 ± 5 mm

Reach合规守则

unknown

时间@峰值回流温度-最大值(s)

30

引脚数量

44

JESD-30代码

S-PQFP-G44

资历状况

不合格

温度等级

INDUSTRIAL

速度

18 MHz

uPs/uCs/外围ICs类型

MICROCONTROLLER

位元大小

8

有ADC

YES

DMA 通道

NO

脉宽调制通道

YES

数模转换器通道

YES

座位高度-最大

1.6 mm

Operating temperature range

-40...+90 deg. C

Shrink temperature

90...130 deg. C

数量

fingers - 5 length (L1) - 60 ± 5 mm

只读存储器可编程性

FLASH

饱和电流

1

Operating voltage

1000 V

Shrink ratio

2:1

宽度

10 mm

直径

before shrink (D) - 57/ (d) - 5x15; after shrink (D1) - 29/ (d1) - 5x7 mm

长度

L = 140 +/- 5 mm