NXP Semiconductors PCF85063TP/1

表面安装

YES

终端数量

8

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Clock Frequency-Max

0.032 MHz

Package Description

HVSON,

Part Package Code

SON

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Life Cycle Code

活跃

Package Code

HVSON

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Supply Voltage-Max

5.5 V

Supply Voltage-Min

0.9 V

Supply Voltage-Nom

3.3 V

ECCN 代码

EAR99

附加功能

ALSO OPERATES AT 1.8 V AT 400KHZ

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

无铅

端子间距

0.5 mm

Reach合规守则

unknown

引脚数量

8

JESD-30代码

R-PDSO-N8

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

TIMER, REAL TIME CLOCK

座位高度-最大

0.8 mm

信息访问方法

SERIAL(I2C)

长度

3 mm

宽度

2 mm