NXP Semiconductors PCF8574P

表面安装

NO

终端数量

16

Gross weight

47.20

Transport packaging size/quantity

48*32*27/250

Mounting hole size

23.5mm

Switching scheme

no(nc)+nc(no)

Button shape/color

round/green

Dielectric strength

1500 (50Hz, 1min) V

Presence and type of lighting

LED 12V

Number of switching cycles (electrical)

≥10000

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

DIP

Package Description

0.300 INCH, PLASTIC, SOT-38-4, DIP-16

Clock Frequency-Max

0.1 MHz

Number of I/O Lines

8

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Max

6 V

Supply Voltage-Min

2.5 V

Supply Voltage-Nom

5 V

JESD-609代码

e4

无铅代码

有

ECCN 代码

EAR99

端子表面处理

镍钯金

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

峰值回流焊温度（摄氏度）

245

端子间距

2.54 mm

深度

68.85mm

Reach合规守则

unknown

引脚数量

16

JESD-30代码

R-PDIP-T16

资历状况

不合格

Contact resistance

≤30mOhm

温度等级

INDUSTRIAL

Insulation resistance

≥1000 (at Uinsp.dc=500V) MOhm

端口的数量

1

uPs/uCs/外围ICs类型

PARALLEL IO PORT, GENERAL PURPOSE

比特数

8

电源电流-最大值

0.1 mA

座位高度-最大

4.7 mm

Operating temperature range

-25…+85 °C

Rated current

5A

Switching voltage

250 (AC) V

直径

60.5mm

长度

21.6 mm

宽度

7.62 mm