NXP Semiconductors PCF8575TS/1

表面安装

YES

Contact plating

gold-plated

Number of pins

76

终端数量

24

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

SSOP

Package Description

5.30 MM, PLASTIC, MO-150AG, SOT340-1, SSOP-24

Clock Frequency-Max

0.4 MHz

Number of I/O Lines

16

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SSOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, SHRINK PITCH

Supply Voltage-Max

5.5 V

Supply Voltage-Min

2.5 V

Supply Voltage-Nom

2.7 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x38

Row pitch

2.54mm

Gross weight

3.42 g

Operating temperature

-40...163°C

JESD-609代码

e4

无铅代码

有

ECCN 代码

EAR99

端子表面处理

镍钯金

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.65 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

30

引脚数量

24

JESD-30代码

R-PDSO-G24

温度等级

INDUSTRIAL

端口的数量

2

uPs/uCs/外围ICs类型

PARALLEL IO PORT, GENERAL PURPOSE

座位高度-最大

2 mm

Rated voltage

60V

个人资料

beryllium copper

饱和电流

1

长度

8.2 mm

宽度

5.3 mm

Plating thickness

0.254µm

Flammability rating

UL94V-0