NXP Semiconductors PZ3064DS10EC

表面安装

YES

终端数量

56

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

LFBGA,

Clock Frequency-Max

90 MHz

Number of I/O Lines

44

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA56,10X10,20

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Max

3.6 V

Supply Voltage-Min

2.7 V

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B56

资历状况

不合格

温度等级

INDUSTRIAL

传播延迟

11.5 ns

组织结构

2 DEDICATED INPUTS, 44 I/O

座位高度-最大

1.35 mm

可编程逻辑类型

EE PLD

输出功能

MACROCELL

专用输入数量

2

长度

6 mm

宽度

6 mm