NXP Semiconductors SC16C852SVIET

Contact plating

gold-plated

表面安装

YES

Number of pins

49

终端数量

36

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x49

Gross weight

4.21 g

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

BGA

Package Description

TFBGA,

Manufacturer Package Code

SOT-912-1

Clock Frequency-Max

80 MHz

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Supply Voltage-Max

1.95 V

Supply Voltage-Min

1.65 V

Supply Voltage-Nom

1.8 V

Operating temperature

-40...163°C

JESD-609代码

e1

无铅代码

有

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

未说明

端子间距

0.5 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

未说明

引脚数量

36

JESD-30代码

S-PBGA-B36

资历状况

不合格

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

座位高度-最大

1.15 mm

地址总线宽度

8

边界扫描

NO

低功率模式

YES

外部数据总线宽度

8

串行I/O数

2

Rated voltage

60V

最大数据传输率

0.0000012122176018 MBps

通信协议

ASYNC, BIT

数据编码/解码方式

NRZ

个人资料

beryllium copper

饱和电流

1

长度

3.5 mm

宽度

3.5 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0