NXP Semiconductors SC18IS601IPW

表面安装

YES

终端数量

16

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

TSSOP

Package Description

4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16

Clock Frequency-Max

18 MHz

Moisture Sensitivity Levels

1

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Equivalence Code

TSSOP16,.25

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Supply Voltage-Max

3.6 V

Supply Voltage-Min

2.4 V

JESD-609代码

e3

端子表面处理

TIN

HTS代码

8542.31.00.01

端子位置

DUAL

终端形式

鸥翼

端子间距

0.65 mm

Reach合规守则

unknown

引脚数量

16

JESD-30代码

R-PDSO-G16

资历状况

不合格

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, I2C

电源电流-最大值

16 mA

座位高度-最大

1.1 mm

最大数据传输率

0.375 MBps

长度

5 mm

宽度

4.4 mm