NXP Semiconductors SPC5642AF0MVZ1

引脚数

324

Lead Shape

Ball

PCB changed

324

Package Width

23

Package Length

23

Package Height

1.95(Max)

Mounting

表面贴装

Supplier Package

TEBGA

Standard Package Name

BGA

CECC Qualified

无

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-40

Maximum Power Dissipation (mW)

1500

Maximum Operating Supply Voltage (V)

5.25|1.32|3.6

Typical Operating Supply Voltage (V)

5|1.2|3.3

Minimum Operating Supply Voltage (V)

4.75|3|1.14

Special Features

CAN控制器

Watchdog

1

I2S

0

I2C

0

UART

0

USART

0

ADC Resolution (bit)

12/12

Number of ADCs

Dual

No. of Timers

2

Number of I/Os

120

Interface Type

CAN/SCI/SPI

Programmability

有

Data Bus Width (bit)

32

Maximum Clock Rate (MHz)

150

Maximum CPU Frequency (MHz)

150

Instruction Set Architecture

RISC

Family Name

MPC56xx

ECCN (US)

3A991

包装

Tray

零件状态

Obsolete

内存大小

128KB

程序存储器类型

Flash

程序内存大小

2MB

核心架构

e200

以太网

0

USB

0

SPI,SPI

3

CAN

3

ADC Channels

40/40

设备核心

e200z4

RoHS状态

符合RoHS标准