NXP Semiconductors TDA8939TH

表面安装

YES

终端数量

24

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

SOIC

Package Description

HSSOP,

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HSSOP

Package Equivalence Code

SOP24,.56,40

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

附加功能

IT CAN ALSO OPERATES WITH 20V TO 60V SUPPLY

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

功能数量

1

端子间距

1 mm

Reach合规守则

unknown

引脚数量

24

JESD-30代码

R-PDSO-G24

资历状况

不合格

电源电压-最大值(Vsup)

30 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

10 V

座位高度-最大

3.5 mm

消费者集成电路类型

消费电路

长度

15.9 mm

宽度

11 mm