NXP USA Inc. ISP1160BD/01

表面安装

YES

终端数量

64

Part Package Code

QFP

Risk Rank

5.02

Supply Voltage-Max

3.6 V

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Life Cycle Code

Transferred

Manufacturer

恩智浦半导体

Package Shape

SQUARE

Package Code

LFQFP

Clock Frequency-Max

6 MHz

Manufacturer Part Number

ISP1160BD/01

Rohs Code

有

Operating Temperature-Max

85 °C

Supply Voltage-Min

3 V

Supply Voltage-Nom

3.3 V

Operating Temperature-Min

-40 °C

Package Equivalence Code

QFP64,.47SQ,20

Package Body Material

PLASTIC/EPOXY

Moisture Sensitivity Levels

1

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Package Description

LFQFP, QFP64,.47SQ,20

附加功能

OPERATES AT 5V SUPPLY WITH REGULATOR

子类别

总线控制器

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

端子间距

0.5 mm

引脚数量

64

JESD-30代码

S-PQFP-G64

资历状况

不合格

电源

3.3/5 V

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, UNIVERSAL SERIAL BUS

座位高度-最大

1.6 mm

地址总线宽度

1

外部数据总线宽度

16

总线兼容性

SH-3; SH-4; ARM7; ARM9; STRONGARM; MIPS

长度

10 mm

宽度

10 mm

达到SVHC

compliant