NXP USA Inc. ISP1362BD118

表面安装

YES

终端数量

64

Package Description

QFP, QFP64,.47SQ,20

Package Style

FLATPACK

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

QFP64,.47SQ,20

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

ISP1362BD,118

Package Code

QFP

Package Shape

SQUARE

Manufacturer

恩智浦半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.84

子类别

总线控制器

端子位置

QUAD

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PQFP-G64

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL